Invention Grant
- Patent Title: Substrate processing method and substrate processing device
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Application No.: US15559076Application Date: 2016-02-25
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Publication No.: US10668497B2Publication Date: 2020-06-02
- Inventor: Yusuke Akizuki
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7897e3d5 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@559e77dc
- International Application: PCT/JP2016/055646 WO 20160225
- International Announcement: WO2016/152371 WO 20160929
- Main IPC: B05C11/10
- IPC: B05C11/10 ; G03F7/42 ; H01L21/67 ; H01L21/311 ; B05C11/08 ; B05D7/24 ; H01L21/027 ; C09K13/08
Abstract:
In order to solve the problem of satisfactorily removing a resist from the surface of a substrate, the present invention is a substrate processing device (1) having a spin chuck (5) and an SPM feed unit (6) for feeding SPM to the substrate (W) held by the spin chuck (5), wherein the SPM feed unit (6) includes a mixing unit (30) for mixing an aqueous hydrogen peroxide solution and hydrofluoric acid and producing a liquid mixture of hydrogen peroxide water and hydrofluoric acid, and an HF-mixed SPM production unit (14) for mixing the liquid mixture and sulfuric acid and producing HF-mixed SPM.
Public/Granted literature
- US20180071772A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE Public/Granted day:2018-03-15
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