Invention Grant
- Patent Title: Laser processing apparatus
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Application No.: US15148495Application Date: 2016-05-06
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Publication No.: US10668569B2Publication Date: 2020-06-02
- Inventor: Kentaro Odanaka , Hironari Ohkubo , Zentaro Kawasaki
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7c9a5f22
- Main IPC: B23K26/364
- IPC: B23K26/364 ; B23K26/03 ; B23K26/06 ; B23K26/08 ; B23K101/40

Abstract:
Disclosed herein is a laser processing apparatus including a controller. The controller includes a target pattern detecting section performing matching between patterns formed in each device imaged and a key pattern to thereby detect a target pattern included in each device, a spacing detecting section detecting the spacing in a Y direction between the target pattern and an ablation groove formed along each division line by ablation, and a map creating section creating a map showing the spacing in the Y direction between each target pattern and the ablation groove for the plural devices arranged along the ablation groove.
Public/Granted literature
- US20160332260A1 LASER PROCESSING APPARATUS Public/Granted day:2016-11-17
Information query
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