Invention Grant
- Patent Title: Ion implantation apparatus and ion implantation method
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Application No.: US16270960Application Date: 2019-02-08
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Publication No.: US10672586B2Publication Date: 2020-06-02
- Inventor: Sho Kawatsu , Noriyasu Ido
- Applicant: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7954fdb3
- Main IPC: H01J37/147
- IPC: H01J37/147 ; H01J37/317 ; H01J37/20

Abstract:
A beamline device includes a deflection device deflecting an ion beam in a first direction perpendicular to a beam traveling direction by applying at least one of an electric field and a magnetic field to the ion beam. A slit is disposed such that the first direction coincides with a slit width direction. A beam current measurement device is configured to be capable of measuring a beam current at a plurality of measurement positions to be different positions in the first direction. A control device calculates angle information in the first direction on the ion beam by acquiring a plurality of beam current values measured at the plurality of measurement positions to be the different positions in the first direction by the beam current measurement device while changing a deflection amount of the ion beam in the first direction with the deflection device.
Public/Granted literature
- US20190244782A1 ION IMPLANTATION APPARATUS AND ION IMPLANTATION METHOD Public/Granted day:2019-08-08
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