Techniques are disclosed for insulating or electrically isolating select vias within a given interconnect layer, so a conductive routing can skip over those select isolated vias to reach other vias or interconnects in that same layer. Such a via blocking layer may be selectively implemented in any number of locations within a given interconnect as needed. Techniques for forming the via blocking layer are also provided, including a first methodology that uses a sacrificial passivation layer to facilitate selective deposition of insulator material that form the via blocking layer, a second methodology that uses spin-coating of wet-recessible polymeric formulations to facilitate selective deposition of insulator material that form the via blocking layer, and a third methodology that uses spin-coating of nanoparticle formulations to facilitate selective deposition of insulator material that form the via blocking layer. Harmful etching processes typically associated with conformal deposition processes is avoided.