Invention Grant
- Patent Title: Multi-RDL structure packages and methods of fabricating the same
-
Application No.: US16048826Application Date: 2018-07-30
-
Publication No.: US10672712B2Publication Date: 2020-06-02
- Inventor: Milind S. Bhagavat , Lei Fu , Farshad Ghahghahi
- Applicant: Milind S. Bhagavat , Lei Fu , Farshad Ghahghahi
- Applicant Address: US CA Santa Clara
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Timothy M. Honeycutt
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/31 ; H01L21/48 ; H01L25/16 ; H01L25/065 ; H01L21/56 ; H01L25/00 ; H01L21/683 ; H01L23/00
Abstract:
Various arrangements of multi-RDL structure devices are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer structure and a second redistribution layer structure mounted on the first redistribution layer structure. A first semiconductor chip is mounted on the second redistribution layer structure and electrically connected to both the second redistribution layer structure and the first redistribution layer structure.
Public/Granted literature
- US20200035606A1 MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME Public/Granted day:2020-01-30
Information query
IPC分类:
