Invention Grant
- Patent Title: Vertical FET with shaped spacer to reduce parasitic capacitance
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Application No.: US15838890Application Date: 2017-12-12
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Publication No.: US10672887B2Publication Date: 2020-06-02
- Inventor: Junli Wang , Kangguo Cheng , Theodorus E. Standaert , Veeraraghavan S. Basker
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/423 ; H01L29/78

Abstract:
A vertical transistor includes a first source/drain region and a second source/drain region vertically disposed relative to the first source/drain region and coupled to the first source/drain region by a fin. A gate dielectric is formed on the fin, and a gate conductor is formed on the gate dielectric in a region of the fin. A shaped spacer is configured to cover a lower portion and sides of the second source/drain region to reduce parasitic capacitance between the gate conductor and the second source/drain region.
Public/Granted literature
- US20190181238A1 VERTICAL FET WITH SHAPED SPACER TO REDUCE PARASITIC CAPACITANCE Public/Granted day:2019-06-13
Information query
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