Invention Grant
- Patent Title: Light-emitting semiconductor chip, light-emitting component and method for producing a light-emitting component
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Application No.: US16091080Application Date: 2017-04-10
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Publication No.: US10672962B2Publication Date: 2020-06-02
- Inventor: Siegfried Herrmann , Michael Völkl
- Applicant: OSRAM OLED GMBH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@79ab6e16
- International Application: PCT/EP2017/058540 WO 20170410
- International Announcement: WO2017/178424 WO 20171019
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/38 ; H01L33/48 ; H01L27/15 ; H01L33/00 ; H01L33/22 ; H01L33/32 ; H01L33/44 ; H01L33/50 ; H01L33/56 ; H01L33/60 ; H01L25/075

Abstract:
A light-emitting semiconductor chip, a light-emitting component and a method for producing a light-emitting component are disclosed. In an embodiment a light-emitting semiconductor chip includes a substrate having a top surface, a bottom surface opposite the top surface and a first side surface extending transversely or perpendicularly to the bottom surface, a semiconductor body arranged on the top surface of the substrate, the semiconductor body comprising an active region configured to generate light and a contacting comprising a first current distribution structure and a second current distribution structure, which is formed to supply current to the active region, wherein the semiconductor chip is free of any connection point on a side of the semiconductor body facing away from the substrate and on the bottom surface of the substrate, and wherein the connection point is a connection point for electrically contacting the first and second current distribution structures.
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