Invention Grant
- Patent Title: Multi-layer slot die system and method
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Application No.: US15447006Application Date: 2017-03-01
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Publication No.: US10675654B2Publication Date: 2020-06-09
- Inventor: David J. Kuenne
- Applicant: NORDSON CORPORATION
- Applicant Address: US OH Westlake
- Assignee: Nordson Corporation
- Current Assignee: Nordson Corporation
- Current Assignee Address: US OH Westlake
- Agency: Baker & Hostetler LLP
- Main IPC: B05C5/02
- IPC: B05C5/02 ; B29C48/31 ; B29C48/25 ; B29C48/30 ; B05C9/06 ; B05D7/00 ; B05D1/26

Abstract:
A multi-layer slot die and method are provided. The multi-layer slot die comprises an upper body member, a lower body member, and a center body member. The upper body member has an upper surface and an upper rear surface. The lower body member has a lower surface and a lower rear surface. The center body has an upper center surface, a lower center surface, and a center rear surface. The upper center surface is spaced apart from the upper surface of the upper body member forming a first channel therebetween. The lower center surface is spaced apart from the lower surface of the lower body member forming a second channel therebetween. The first channel includes a first opening and the second channel includes a second opening. The first and second openings are substantially parallel to the upper rear surface, the lower rear surface, and the center rear surface.
Public/Granted literature
- US20180250701A1 MULTI-LAYER SLOT DIE SYSTEM AND METHOD Public/Granted day:2018-09-06
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