Invention Grant
- Patent Title: Resistive memory, manufacturing method thereof and chemical mechanical polishing process
-
Application No.: US16170056Application Date: 2018-10-25
-
Publication No.: US10680173B2Publication Date: 2020-06-09
- Inventor: Yu-Jen Lin , Yi-Chung Chen , Cheng-Jen Lai
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3a073557
- Main IPC: H01L45/00
- IPC: H01L45/00 ; B24B1/00

Abstract:
A resistive memory, a manufacturing method thereof, and a chemical mechanical polishing process are provided. The resistive memory includes a first electrode, a variable resistance layer, and a second electrode. The first electrode is disposed on a substrate. The variable resistance layer is disposed on the first electrode. The second electrode is disposed on the variable resistance layer. The first electrode includes a first Ti layer, a Ti oxide layer, and a conductive layer sequentially disposed on the substrate.
Public/Granted literature
- US20190131522A1 RESISTIVE MEMORY, MANUFACTURING METHOD THEREOF AND CHEMICAL MECHANICAL POLISHING PROCESS Public/Granted day:2019-05-02
Information query
IPC分类: