A communication system includes a host circuit board and an interposer assembly coupled to the host circuit board having an interposer substrate including an upper surface and a lower surface. The interposer assembly has host circuit board contacts electrically connected to contact pads of the host circuit board and cable assembly contacts coupled to a pluggable module. The pluggable module includes a mating interface along a bottom of the pluggable module facing the interposer assembly. The pluggable module includes a cable assembly having a cable at the cable end. The cable has a signal conductor and a ground conductor being electrically connected to corresponding cable assembly contacts of the interposer assembly at the upper surface of the interposer substrate.