Invention Grant
- Patent Title: Systems and methods for on-chip temperature stabilization for temperature-sensitive components of integrated circuits
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Application No.: US15853140Application Date: 2017-12-22
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Publication No.: US10680618B2Publication Date: 2020-06-09
- Inventor: Laszlo Hars
- Applicant: THE BOEING COMPANY
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Womble Bond Dickinson LLP
- Main IPC: H03L1/04
- IPC: H03L1/04 ; H03K3/03

Abstract:
An integrated circuit system is provided. The system includes a ring oscillator including a first plurality of logic gates connected in a ring configuration. The system also includes a second plurality of logic gates used to implement a heater to generate a controlled amount of heat. The second plurality of logic gates is also used to implement a temperature sensor to measure a temperature of the ring oscillator. The system further includes one or more logic circuits coupled to the heater and the temperature sensor. The one or more logic circuits are used to control the heater to heat the ring oscillator only until the temperature of the ring oscillator is one of a plurality of predefined temperatures, during or after which the ring oscillator starts and operate.
Public/Granted literature
- US20190386664A1 COUNTERMEASURES TO PHASE TRACKING ATTACKS ON RING OSCILLATOR BASED ENTROPY SOURCES Public/Granted day:2019-12-19
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