Invention Grant
- Patent Title: Conductive paste
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Application No.: US15127406Application Date: 2015-03-20
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Publication No.: US10702954B2Publication Date: 2020-07-07
- Inventor: Yoshiaki Yoshii
- Applicant: NAMICS CORPORATION
- Applicant Address: JP Niigata
- Assignee: NAMICS CORPORATION
- Current Assignee: NAMICS CORPORATION
- Current Assignee Address: JP Niigata
- Agency: Holtz, Holtz & Volek PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3cc065a
- International Application: PCT/JP2015/058397 WO 20150320
- International Announcement: WO2015/141816 WO 20150924
- Main IPC: H01B1/20
- IPC: H01B1/20 ; H01B1/22 ; B23K35/30 ; H05K1/09 ; B22F1/00 ; C03C8/18 ; C03C8/20 ; B23K35/36 ; B22F3/10 ; B23K1/00 ; B23K35/02 ; C03C3/14 ; C03C4/14 ; C03C8/02 ; C09D5/24 ; H05K1/18 ; H05K3/12 ; H05K3/34
Abstract:
A conductive paste including (A) a silver powder, (B) a glass frit, (C) an organic binder and (D) a powder containing Cu and at least one metal element selected from the group consisting of V, Cr, Mn, Fe and Co. The powder (D) may thus contain Cu and Mn, Cu and Fe or Cu and Co. The conductive paste has a desirable electromigration resistance, solder heat resistance and adhesiveness to a substrate.
Public/Granted literature
- US20170129058A1 CONDUCTIVE PASTE, LAMINATED CERAMIC PART, PRINTED WIRING BOARD AND ELECTRONIC DEVICE Public/Granted day:2017-05-11
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