Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US16137728Application Date: 2018-09-21
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Publication No.: US10707109B2Publication Date: 2020-07-07
- Inventor: Satoshi Morita , Ryoji Ikebe , Yasuaki Noda , Norihisa Koga , Keisuke Hamamoto , Masato Hosaka
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@146e00
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/68 ; B65G21/10 ; H01L23/544 ; G06T7/00 ; H01L21/687

Abstract:
A substrate processing apparatus includes carry in/out station, transfer station, processing station, and image capturing unit. The carry in/out station includes first conveyance device that takes out and conveys substrate from cassette. The transfer station is disposed adjacent to the carry in/out station, and includes substrate placement unit on which the substrate conveyed by the first conveyance device is placed. The processing station is disposed adjacent to the transfer station, and includes second conveyance device that takes out and conveys the substrate from the substrate placement unit, and a plurality of processing units that processes the substrate conveyed by the second conveyance device. The image capturing unit is disposed in the transfer station, and captures an image of the peripheral edge portion of one of the upper and lower surfaces of the substrate and the end surface of the substrate.
Public/Granted literature
- US20190096730A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2019-03-28
Information query
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