公开(公告)号：US10713772B2

公开(公告)日：2020-07-14

申请号：US14950016

申请日：2015-11-24

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Yuki Ito ,  Eiichiro Okamoto ,  Kazuya Iwanaga ,  Ryoji Ikebe

IPC: G06T7/00 ,  G06T7/62

Abstract: Disclosed is a measurement processing device including: a processing unit configured to control an imaging device to image a substrate, on which a processing film is removed from the peripheral edge portion, and an enclosure member that surrounds the substrate. A captured image obtained by the imaging device is processed to measure a cut width in which the processing film is absent in the peripheral edge portion of the substrate, and a gap width between a peripheral edge end of the substrate and the enclosure member.

公开(公告)号：US20160148366A1

公开(公告)日：2016-05-26

申请号：US14950016

申请日：2015-11-24

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Yuki Ito ,  Eiichiro Okamoto ,  Kazuya Iwanaga ,  Ryoji Ikebe

IPC: G06T7/00 ,  H04N7/18 ,  G06T7/60

Abstract: Disclosed is a measurement processing device including: a processing unit configured to control an imaging device to image a substrate, on which a processing film is removed from the peripheral edge portion, and an enclosure member that surrounds the substrate. A captured image obtained by the imaging device is processed to measure a cut width in which the processing film is absent in the peripheral edge portion of the substrate, and a gap width between a peripheral edge end of the substrate and the enclosure member.

Abstract translation: 公开了一种测量处理装置，包括：处理单元，被配置为控制成像装置对从周缘部分移除处理膜的基板成像，以及围绕基板的封装构件。 对由成像装置获得的拍摄图像进行处理，以测量在基板的周边部分中不存在处理膜的切割宽度，以及基板的周边端部与外壳部件之间的间隙宽度。

公开(公告)号：US11011436B2

公开(公告)日：2021-05-18

申请号：US15454269

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/66 ,  H01L21/67

Abstract: Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.

公开(公告)号：US10128137B2

公开(公告)日：2018-11-13

申请号：US15454346

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

公开(公告)号：US10707109B2

公开(公告)日：2020-07-07

申请号：US16137728

申请日：2018-09-21

Applicant: Tokyo Electron Limited

Inventor： Satoshi Morita ,  Ryoji Ikebe ,  Yasuaki Noda ,  Norihisa Koga ,  Keisuke Hamamoto ,  Masato Hosaka

IPC: H01L21/67 ,  H01L21/68 ,  B65G21/10 ,  H01L23/544 ,  G06T7/00 ,  H01L21/687

Abstract: A substrate processing apparatus includes carry in/out station, transfer station, processing station, and image capturing unit. The carry in/out station includes first conveyance device that takes out and conveys substrate from cassette. The transfer station is disposed adjacent to the carry in/out station, and includes substrate placement unit on which the substrate conveyed by the first conveyance device is placed. The processing station is disposed adjacent to the transfer station, and includes second conveyance device that takes out and conveys the substrate from the substrate placement unit, and a plurality of processing units that processes the substrate conveyed by the second conveyance device. The image capturing unit is disposed in the transfer station, and captures an image of the peripheral edge portion of one of the upper and lower surfaces of the substrate and the end surface of the substrate.

公开(公告)号：US20170287703A1

公开(公告)日：2017-10-05

申请号：US15454154

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/02 ,  G03B17/08 ,  G03B13/32 ,  H01L21/67 ,  B08B3/08

CPC classification number: H01L21/02087 ,  B08B3/08 ,  G03B13/32 ,  G03B17/08 ,  H01L21/6704 ,  H01L21/6708 ,  H01L21/67253 ,  H01L21/67259 ,  H01L22/12 ,  H01L22/20

Abstract: Imaging can be performed well even when an imaging device is disposed at a position facing a peripheral portion of a substrate. A substrate processing apparatus 16 which performs a processing of removing a film on a peripheral portion of a substrate W includes a rotating/holding unit 210 configured to hold and rotate the substrate; a first processing liquid supply unit 250A configured to supply a first processing liquid for removing the film onto the peripheral portion of the substrate while the substrate is being rotated in a first rotational direction R1 by the rotating/holding unit; and an imaging unit 270 provided at a position in front of an arrival region 902 of the first processing liquid on the substrate with respect to the first rotational direction R1, and configured to image the peripheral portion of the substrate.

公开(公告)号：US20210257236A1

公开(公告)日：2021-08-19

申请号：US17242709

申请日：2021-04-28

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.

公开(公告)号：US20190096730A1

公开(公告)日：2019-03-28

申请号：US16137728

申请日：2018-09-21

Applicant: Tokyo Electron Limited

Inventor： Satoshi Morita ,  Ryoji Ikebe ,  Yasuaki Noda ,  Norihisa Koga ,  Keisuke Hamamoto ,  Masato Hosaka

IPC: H01L21/68 ,  H01L23/544 ,  B65G21/10 ,  G06T7/00

Abstract: A substrate processing apparatus includes carry in/out station, transfer station, processing station, and image capturing unit. The carry in/out station includes first conveyance device that takes out and conveys substrate from cassette. The transfer station is disposed adjacent to the carry in/out station, and includes substrate placement unit on which the substrate conveyed by the first conveyance device is placed. The processing station is disposed adjacent to the transfer station, and includes second conveyance device that takes out and conveys the substrate from the substrate placement unit, and a plurality of processing units that processes the substrate conveyed by the second conveyance device. The image capturing unit is disposed in the transfer station, and captures an image of the peripheral edge portion of one of the upper and lower surfaces of the substrate and the end surface of the substrate.

公开(公告)号：US20170287704A1

公开(公告)日：2017-10-05

申请号：US15454269

申请日：2017-03-09

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/02 ,  H01L21/66 ,  G05B19/402 ,  H01L21/67

CPC classification number: H01L22/20 ,  G05B2219/45031 ,  H01L21/6708 ,  H01L21/67253 ,  H01L21/67259 ,  H01L22/12

Abstract: Whether a film on a peripheral portion of a substrate is appropriately removed is rapidly determined without depending on a kind of the film on the peripheral portion to be removed. An acquisition process S502 of acquiring information upon the kind of the film of the substrate; a selection process S503 of selecting a measurement setting corresponding to the acquired kind of the film from a table for measurement settings previously stored in a storage unit; a control process S504 of controlling an imaging unit 270 to image the peripheral portion of the substrate by using the measurement setting selected in the selection process are provided.

公开(公告)号：US12300524B2

公开(公告)日：2025-05-13

申请号：US17242709

申请日：2021-04-28

Applicant: Tokyo Electron Limited

Inventor： Yoshifumi Amano ,  Satoshi Morita ,  Ryoji Ikebe ,  Isamu Miyamoto

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/68

Abstract: A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion of a substrate which is processed based on a substrate processing recipe; a creation process S602 of creating a management list in which a set value of the cut width of the film, a measurement value of the cut width of the film measured through the measurement processing process and time information at which the measurement result is obtained are correlated; an analysis process S603 (S606) of analyzing a state of the processed substrate based on the created management list; and a notification process S605 (S608, S609) of making a preset notification to a user based on an analysis result obtained through the analysis process are provided.