Invention Grant
- Patent Title: Laminated electronic component and circuit board for mounting the same
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Application No.: US16267678Application Date: 2019-02-05
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Publication No.: US10714265B2Publication Date: 2020-07-14
- Inventor: Soo Hwan Son , Seung Hyun Ra , Kyoung Jin Jun , Sang Soo Park , Young Key Kim , Soon Ju Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Seoul KR Seoul
- Assignee: HYUNDAI MOTOR COMPANY,KIA MOTORS CORPORATION
- Current Assignee: HYUNDAI MOTOR COMPANY,KIA MOTORS CORPORATION
- Current Assignee Address: KR Seoul KR Seoul
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@181ccba5
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H01G4/012 ; H01G4/30 ; H05K1/18 ; H05K1/11 ; H01G2/06 ; H01G4/232 ; H01G4/12

Abstract:
A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.
Public/Granted literature
- US20190172651A1 LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME Public/Granted day:2019-06-06
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