Invention Grant
- Patent Title: Packaging material and film
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Application No.: US16175283Application Date: 2018-10-30
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Publication No.: US10717806B2Publication Date: 2020-07-21
- Inventor: Wen-Bin Chen , Kai-Chi Chen , Shu-Chen Huang
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@410a4a00
- Main IPC: C08G59/30
- IPC: C08G59/30 ; C08G59/24 ; C08K5/5419 ; C08K3/36 ; C08K3/22 ; H01L23/31 ; C08K3/26 ; H01L23/29 ; C08L83/06 ; C08L83/08 ; C08G77/04 ; C08G77/26 ; C08G77/14 ; C08G77/12 ; C08L63/00 ; C08L83/00
Abstract:
A packaging material is provided. The packaging material includes (a) epoxy silsesquioxane, (b) epoxy resin, and (c) siloxane-imide-containing benzoxazine compound. (a) Epoxy silsesquioxane and (b) epoxy resin have a weight ratio of 0.3:1 to 10:1. The total weight of (a) epoxy silsesquioxane and (b) epoxy resin and the weight of (c) siloxane-imide-containing benzoxazine compound have a ratio of 100:20 to 100:150.
Public/Granted literature
- US20190127513A1 PACKAGING MATERIAL AND FILM Public/Granted day:2019-05-02
Information query
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