Invention Grant
- Patent Title: Optical package structure, optical module, and method for manufacturing the same
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Application No.: US16118228Application Date: 2018-08-30
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Publication No.: US10720751B2Publication Date: 2020-07-21
- Inventor: Yu-Hsuan Tsai , Lu-Ming Lai , Ying-Chung Chen , Shih-Chieh Tang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: G02B6/02
- IPC: G02B6/02 ; H04B10/50 ; G02B6/35 ; G02B6/42 ; H04B10/80 ; H01S5/022 ; H01L31/0203 ; H01L33/62 ; H01L23/00 ; H01L23/538 ; H01S5/40 ; H01L33/48 ; H01S5/02 ; H01L25/075 ; H01S5/183 ; H01L25/04 ; H01L31/02 ; H01L25/16
Abstract:
An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.
Public/Granted literature
- US20190097387A1 OPTICAL PACKAGE STRUCTURE, OPTICAL MODULE, AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-03-28
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