Invention Grant
- Patent Title: Bottom-up method for forming wire structures upon a substrate
-
Application No.: US16087462Application Date: 2017-03-21
-
Publication No.: US10731268B2Publication Date: 2020-08-04
- Inventor: Filip Granek , Zbigniew Rozynek
- Applicant: XTPL S.A.
- Applicant Address: PL Wroclaw
- Assignee: XTPL S.A.
- Current Assignee: XTPL S.A.
- Current Assignee Address: PL Wroclaw
- Agency: Taft Stettinius & Hollister LLP
- Agent Ryan O. White
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@218593d5
- International Application: PCT/EP2017/056739 WO 20170321
- International Announcement: WO2017/162696 WO 20170928
- Main IPC: C25D13/12
- IPC: C25D13/12 ; C25D13/22 ; B82B3/00 ; H01L29/06 ; H01L21/02 ; H01L21/326 ; H01L21/67 ; H01L21/66 ; H05K3/12 ; G02C7/04

Abstract:
A method is provided for forming structures upon a substrate. The method comprises: depositing fluid onto a substrate so as to define a wetted region, the fluid containing electrically polahzable nanoparticles; applying an alternating electric field to the fluid on the region, using a first electrode and a second electrode, so that a plurality of the nanoparticles are assembled to form an elongate structure extending from the first electrode towards the second electrode; and removing the fluid such that the elongate structure remains upon the substrate.
Public/Granted literature
- US20190106804A1 BOTTOM-UP METHOD FOR FORMING WIRE STRUCTURES UPON A SUBSTRATE Public/Granted day:2019-04-11
Information query