Invention Grant
- Patent Title: Plasma processing apparatus and analysis method for analyzing plasma processing data
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Application No.: US15445203Application Date: 2017-02-28
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Publication No.: US10734207B2Publication Date: 2020-08-04
- Inventor: Ryoji Asakura , Daisuke Shiraishi , Akira Kagoshima , Satomi Inoue
- Applicant: HITACHI HIGH-TECH CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@a4da41a
- Main IPC: H01J37/32
- IPC: H01J37/32 ; G01J3/28 ; G01J3/02 ; G01J3/443

Abstract:
According to the present invention, a plasma processing apparatus includes an analysis unit that obtains wavelengths of the light correlated with a plasma processing result, selects, from the obtained wavelengths, a wavelength having a first factor that represents a deviation in an intensity distribution of the light and is larger than a first predetermined value, and predicts the plasma processing result using the selected wavelength, or an analysis unit that obtains values computed using each of light intensities of a plurality of wavelengths and correlated with the plasma processing result, selects, from the obtained values, a value having a second factor that represents a deviation in a distribution of the obtained values and is larger than a second predetermined value, and predicts the plasma processing result using the selected value.
Public/Granted literature
- US20180025894A1 PLASMA PROCESSING APPARATUS AND ANALYSIS METHOD FOR ANALYZING PLASMA PROCESSING DATA Public/Granted day:2018-01-25
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