Invention Grant
- Patent Title: Underfill solution supplying device for a dispenser, dispenser including the same, and method of manufacturing a semiconductor module using the same
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Application No.: US16181570Application Date: 2018-11-06
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Publication No.: US10734258B2Publication Date: 2020-08-04
- Inventor: Seong-Chan Han , Young-Rock Lee , Han-Ju Kim , Hun Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@24690472
- Main IPC: B05C5/02
- IPC: B05C5/02 ; B05C11/10 ; B05C11/11 ; B05C17/005 ; B05C17/015 ; H01L21/67 ; H01L23/00 ; H01L21/56 ; H01L25/18

Abstract:
A dispenser includes a syringe container having a first end and a second end, the syringe container having a length direction extending between the first end and the second end, a plunger movable within the syringe container along the length direction of the syringe container and configured to be positioned on a surface of an underfill solution to be received within the syringe container at a first region between the plunger and the second end, a cap attached airtightly to the first end of the syringe container, a first gas supply line configured to supply a first gas into the syringe container through the cap, and a second gas supply line extending from the cap to the plunger, the second gas supply line being in fluid communication with the first region and configured to supply a second gas into the underfill solution to be received within the syringe container at the first region through a through hole of the plunger.
Public/Granted literature
Information query