Invention Grant
- Patent Title: Self-aligned semiconductor gate cut
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Application No.: US16271803Application Date: 2019-02-09
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Publication No.: US10741401B1Publication Date: 2020-08-11
- Inventor: Peng Xu , Kangguo Cheng , Ruqiang Bao
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Intelletek Law Group, PLLC
- Agent Gabriel Daniel, Esq.
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/66 ; H01L21/8234 ; H01L27/088

Abstract:
A semiconductor and a method of creating the same are provided. The semiconductor structure includes a first set of fins and a second set of fins disposed on a substrate. There is a high-k dielectric disposed on top of the substrate and the first and second set of fins. There is a work-function metal disposed on top of the high-k dielectric. There is a pinch-off layer disposed on top of the work-function metal (WFM). There is a first dielectric layer disposed on top of the pinch-off layer. There is a second dielectric material configured as a gate cut between the first set of fins and the second set of fins, wherein the second dielectric material cuts through the nitride, pinch-off, and WFM layers.
Public/Granted literature
- US20200258745A1 Self-Aligned Semiconductor Gate Cut Public/Granted day:2020-08-13
Information query
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