Invention Grant
- Patent Title: Diamond-like carbon film
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Application No.: US16002222Application Date: 2018-06-07
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Publication No.: US10745282B2Publication Date: 2020-08-18
- Inventor: Eswaranand Venkatasubramanian , Samuel E. Gottheim , Pramit Manna , Abhijit Basu Mallick
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C01B32/28 ; H01L21/308 ; C01B32/26 ; H01L21/311 ; C01B32/25 ; H01L21/033 ; C23C16/26 ; C23C16/505
Abstract:
Apparatuses and methods to manufacture integrated circuits are described. A method of forming film on a substrate is described. The film is formed on a substrate by exposing a substrate to a diamond-like carbon precursor having an sp3 content of greater than 40 percent. Methods of etching a substrate are described. Electronic devices comprising a diamond-like carbon film are also described.
Public/Granted literature
- US20180354804A1 Diamond-Like Carbon Film Public/Granted day:2018-12-13
Information query
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