Invention Grant
- Patent Title: Epoxy resin composition
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Application No.: US16172080Application Date: 2018-10-26
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Publication No.: US10745550B2Publication Date: 2020-08-18
- Inventor: Feng-Ming Hsieh , Mei-Hua Wang
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@339b22a1
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L63/02 ; C08L63/04 ; C08L15/00 ; C08G59/20 ; C08G59/40 ; C08G59/42 ; C08G59/44 ; C08G59/50

Abstract:
An epoxy resin composition is provided. The epoxy resin composition includes 80-100 parts by weight of a thermal curable epoxy resin, and 0.1-20 parts by weight of a branched rubber copolymer. The branched rubber copolymer includes a rubber polymer serving as a main portion, and a polymer composed of polyethylene glycol (PEG), derivatives of polyethylene glycol, polycaprolactone (PCL), derivatives of polycaprolactone, or a combination thereof serving as a branched chain.
Public/Granted literature
- US20190127572A1 EPOXY RESIN COMPOSITION Public/Granted day:2019-05-02
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