Invention Grant
- Patent Title: Laptop computer with integral cooling
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Application No.: US16226360Application Date: 2018-12-19
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Publication No.: US10747277B2Publication Date: 2020-08-18
- Inventor: Jeff Ku , Shantanu D Kulkarni , Gavin Sung
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20

Abstract:
System and method for transferring heat generated by internal electronic components of a mobile computer to its external environment. Heat absorption and transfer elements disposed, in part, proximate heat-producing components move the heat to a remote heat sink assembly adapted to dissipate the heat. Example embodiments include one or more fans to produce internal airflow(s) that further facilitate internal heat transfer.
Public/Granted literature
- US20190129480A1 LAPTOP COMPUTER WITH INTEGRAL COOLING Public/Granted day:2019-05-02
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