In order to specify a dust emitting mechanism portion, a wafer must be provided near a mechanism portion in operation and the mechanism portion must be operated so that foreign matter sticks to a surface of the wafer. A mechanism that allows foreign matter to stick to a wafer by repeating operation of each of particular portions in a device and thus intentionally bringing about dust emission is provided. For example, the device includes a control device, a sample chamber in which a sample is processed, and a mechanism that loads and unloads a sample to and from the sample chamber, the mechanism has a plurality of portions, the control device has a script, and a particular portion of the plurality of portions of the mechanism is repeatedly operated as the control device executes the script.