A semiconductor substrate includes a multi-layered structure, a component and a first conductive via. The multi-layered structure includes a plurality of dielectric layers and a plurality of patterned conductive layers. A topmost patterned conductive layer of the patterned conductive layers is embedded in a topmost dielectric layer of the dielectric layers. The component is embedded in the multi-layered structure. The first conductive via is electrically connected to the component and one of the patterned conductive layers. At least one of the patterned conductive layers is located at a depth spanning between a top surface of the passive layer and a bottom surface of the component