Invention Grant
- Patent Title: Optoelectronic component and method of producing an optoelectronic component
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Application No.: US16091321Application Date: 2017-04-07
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Publication No.: US10749084B2Publication Date: 2020-08-18
- Inventor: Thomas Reeswinkel
- Applicant: OSRAM OLED GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: DLA Piper LLP (US)
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5f16c1c5
- International Application: PCT/EP2017/058371 WO 20170407
- International Announcement: WO2017/174779 WO 20171012
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/56 ; H01L33/60 ; H01L33/62 ; H01L23/00 ; H01L27/02 ; H01L33/48 ; H01L25/16
Abstract:
An optoelectronic component includes a carrier having a chip mounting face, wherein the chip mounting face has a reflection coating, and an optoelectronic semiconductor chip adhesively bonded on the reflection coating by an adhesive so that the reflection coating is subdivided into a first subsection covered by the semiconductor chip and a second subsection, which is free of the semiconductor chip, wherein the adhesive has reflection particles that reflect electromagnetic radiation emitted by the semiconductor chip, and the second subsection is at least partially covered by a corrosion protection layer.
Public/Granted literature
- US20190157525A1 OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT Public/Granted day:2019-05-23
Information query
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