Invention Grant
- Patent Title: Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
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Application No.: US15075192Application Date: 2016-03-20
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Publication No.: US10750071B2Publication Date: 2020-08-18
- Inventor: Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
- Applicant: NINGBO SUNNY OPOTECH CO., LTD.
- Applicant Address: CN Ningbo, Zhejiang
- Assignee: Ningbo Sunny Opotech Co., Ltd.
- Current Assignee: Ningbo Sunny Opotech Co., Ltd.
- Current Assignee Address: CN Ningbo, Zhejiang
- Agency: David and Raymond Patent Firm
- Agent Raymond Y. Chan
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@32cbf0f7 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2040f480 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@78d23fd4 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@639ae1e9
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N13/239 ; H01L27/146
Abstract:
A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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