Invention Grant
- Patent Title: Method of forming a laminate structure having a plated through-hole using a removable cover layer
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Application No.: US14312679Application Date: 2014-06-23
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Publication No.: US10757819B2Publication Date: 2020-08-25
- Inventor: Shinichi Iketani , Dale Kersten
- Applicant: Sanmina Corporation
- Applicant Address: US CA San Jose
- Assignee: SANMINA CORPORATION
- Current Assignee: SANMINA CORPORATION
- Current Assignee Address: US CA San Jose
- Agency: Loza & Loza, LLP
- Agent Julio M. Loza; Tyler J. Barrett
- Main IPC: H05K3/26
- IPC: H05K3/26 ; H05K1/03 ; H05K1/05 ; H05K3/00 ; H05K3/42
Abstract:
A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.
Public/Granted literature
- US20150007933A1 METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE USING A REMOVABLE COVER LAYER Public/Granted day:2015-01-08
Information query
