Invention Grant
- Patent Title: Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device
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Application No.: US16110394Application Date: 2018-08-23
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Publication No.: US10761424B2Publication Date: 2020-09-01
- Inventor: Ryo Nishio , Masafumi Kojima , Akiyoshi Goto , Tomotaka Tsuchimura , Michihiro Shirakawa , Keita Kato
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@56ef6885
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; G03F7/038 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/38 ; C07C309/12 ; C07C309/17 ; C07C381/12 ; C07C309/15 ; C07C321/28 ; C07D213/70 ; C07D217/08 ; C07D327/08 ; C07D333/46 ; C07D335/16 ; C07J31/00 ; C07J9/00 ; C07J43/00
Abstract:
The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is capable of forming a pattern having a low LWR and is further suppressed in the collapse of the formed pattern, a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a photoacid generator represented by General Formula (1) or a resin having a residue obtained by removing one hydrogen atom from the photoacid generator represented by General Formula (1).
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