Invention Grant
- Patent Title: Stage and substrate processing apparatus
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Application No.: US15815447Application Date: 2017-11-16
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Publication No.: US10763764B2Publication Date: 2020-09-01
- Inventor: Tsutomu Hiroki
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Fenwick & West LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@690a0863
- Main IPC: H02N13/00
- IPC: H02N13/00 ; F28C3/00 ; H01L21/683 ; H01L21/67 ; F28D1/04 ; B05C11/00 ; B05B5/025

Abstract:
A stage includes a heat exchanger, a plate provided on the heat exchanger and including a first main surface and a second main surface opposite to each other, the plate having a plurality of through-holes extending in a plate thickness direction, and an electrostatic chuck having a top surface on which a substrate is mounted and a bottom surface attached to the first main surface. The heat exchanger includes a plurality of first tubes having a plurality of opening ends facing a plurality of regions on the bottom surface which are exposed to the respective through-holes and a plurality of second tubes communicating with the through-holes.
Public/Granted literature
- US20180138835A1 STAGE AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2018-05-17
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