Invention Grant
- Patent Title: Poly(amide-imide) resin composition and fluorochemical coating material
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Application No.: US15781201Application Date: 2016-12-05
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Publication No.: US10766999B2Publication Date: 2020-09-08
- Inventor: Atsushi Takahashi
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3ebd32de
- International Application: PCT/JP2016/086025 WO 20161205
- International Announcement: WO2017/099030 WO 20170615
- Main IPC: C08G18/08
- IPC: C08G18/08 ; C08G18/10 ; C08G18/34 ; C08G18/76 ; C08G18/80 ; C08G73/10 ; C08G73/14 ; C08K3/22 ; C08K5/357 ; C08L79/08 ; C09D7/20 ; C09D7/40 ; C09D7/65 ; C09D179/08 ; C09D201/04

Abstract:
A polyamideimide resin composition containing: (A) a polyamideimide resin which has isocyanate groups at the terminals and in which at least a portion of the isocyanate groups are blocked with a blocking agent selected from the group consisting of alcohols, oximes and lactams, (B) N-formylmorpholine, and (C) water.
Public/Granted literature
- US20180355095A1 POLY(AMIDE-IMIDE) RESIN COMPOSITION AND FLUOROCHEMICAL COATING MATERIAL Public/Granted day:2018-12-13
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