Invention Grant
- Patent Title: Substrate processing method
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Application No.: US16040755Application Date: 2018-07-20
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Publication No.: US10770257B2Publication Date: 2020-09-08
- Inventor: Yuko Kengoyama , Takashi Yoshida
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Studebaker & Brackett PC
- Main IPC: H05H1/46
- IPC: H05H1/46 ; H01J37/02 ; C23C16/56 ; C23C16/509 ; H01L21/687 ; H01L21/3065 ; H01L21/31

Abstract:
Examples of a substrate processing method include subjecting a substrate placed on a susceptor to plasma processing, applying power to an RF electrode facing the susceptor for only a predetermined static electricity removal time to generate plasma, thereby reducing an amount of charge of the substrate, measuring a self-bias voltage of the RF electrode while susceptor pins are made to protrude from a top surface of the susceptor and lift up the substrate, and by a controller, shortening the static electricity removal time when the self-bias voltage has a positive value, and lengthening the static electricity removal time when the self-bias voltage has a negative value.
Public/Granted literature
- US20200027685A1 SUBSTRATE PROCESSING METHOD Public/Granted day:2020-01-23
Information query
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