Invention Grant
- Patent Title: Semiconductor device package, optical package, and method for manufacturing the same
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Application No.: US16132206Application Date: 2018-09-14
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Publication No.: US10770624B2Publication Date: 2020-09-08
- Inventor: Chang Chin Tsai , Chun-Han Chen , Hsin-Ying Ho
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01S5/022 ; H01S5/40 ; H01L33/56 ; H01L23/528 ; H01L33/62
Abstract:
A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.
Public/Granted literature
- US20190115505A1 SEMICONDUCTOR DEVICE PACKAGE, OPTICAL PACKAGE, AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-04-18
Information query
IPC分类:
