Invention Grant
- Patent Title: Semi-differential signaling for DSI3 bus enhancement
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Application No.: US16673607Application Date: 2019-11-04
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Publication No.: US10771281B1Publication Date: 2020-09-08
- Inventor: Tomas Suchy , Lukas Vykydal , Pavel Hartl , Marek Hustava
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Ramey & Schwaller, LLP
- Main IPC: H04B3/00
- IPC: H04B3/00 ; H04L12/40 ; H04L25/02

Abstract:
A semi-differential signaling technique as well as bus devices and communication systems that exploit this technique to enhance the performance of the DSI3 bus. In one embodiment, there is provided a DSI3 master device that can be coupled to a DSI3 slave device via a bus having at least a power supply conductor, a power return conductor, and a signal conductor. The master device includes: a power supply node and a power return node that respectively connect to the power supply conductor and the power return conductor to supply power to the slave device; a signal node that connects to the signal conductor; and a driver that drives the signal node relative to a reference voltage midway between voltages of the power supply node and the power return node.
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