Invention Grant
- Patent Title: Semiconductor memory device
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Application No.: US16249907Application Date: 2019-01-17
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Publication No.: US10777272B2Publication Date: 2020-09-15
- Inventor: Hajime Aoki
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4f609a6c
- Main IPC: G11C13/00
- IPC: G11C13/00 ; G11C11/16 ; G11C7/14

Abstract:
The disclosure provides a semiconductor memory device that improves the reliability of data reading and achieves good area efficiency. A variable resistance memory of the disclosure includes a memory array, a row decoder, a column decoder, a writing part, and a reading part. The memory array includes a plurality of memory cells. The row decoder selects the memory cells in a row direction. The column decoder selects the memory cells in a column direction. The writing part writes identical data to a pair of memory cells that is selected. The reading part reads the data stored in the pair of memory cells that is selected. The reading part includes a sense amplifier that compares a total of the currents respectively flowing through the pair of memory cells with a reference value.
Public/Granted literature
- US20190252019A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2019-08-15
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