- Patent Title: Global shutter CMOS image sensor and method for forming the same
-
Application No.: US16371515Application Date: 2019-04-01
-
Publication No.: US10777593B2Publication Date: 2020-09-15
- Inventor: Bo-Ray Lee
- Applicant: Silicon Optronics, Inc.
- Applicant Address: TW Hsinchu
- Assignee: Silicon Optronics, Inc.
- Current Assignee: Silicon Optronics, Inc.
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5bb1bdb3
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A global shutter CMOS image sensor includes a photodiode, a floating diffusion region, and a storage diode disposed in the upper portion of the substrate. The storage diode is disposed between the photodiode and the floating diffusion region. A first transfer gate is disposed on the substrate between the photodiode and the storage node. A second transfer gate is disposed on the substrate between the storage diode and the floating diffusion region. A first dielectric layer is disposed on the substrate and covers the first transfer gate and the second transfer gate. A light-shielding layer is disposed on the first dielectric layer. A light pipe is disposed through the light-shielding layer and a portion of the first dielectric layer, and is correspondingly disposed above the photodiode. The light pipe has a higher refractive index than the first dielectric layer.
Public/Granted literature
- US20190393255A1 GLOBAL SHUTTER CMOS IMAGE SENSOR AND METHOD FOR FORMING THE SAME Public/Granted day:2019-12-26
Information query
IPC分类: