Abstract:
An image-sensing system for the efficient detection of defective pixels is shown. An arithmetic logic unit (ALU) determines a defective pixel candidate of an image sensor based on the first frame captured by the image sensor, performs a lower-part comparison on the defective pixel candidate based on the first frame, and performs an upper-part comparison on the defective pixel candidate based on the second frame captured by the image sensor. The defective pixel candidate is confirmed to be defective based on the first frame as well as the second frame. Only limited pixel data is buffered for the defective pixel detection.
Abstract:
Image-sensing devices are provided. An image-sensing device includes a substrate, a first dielectric layer, an image sensor array, a plurality of nanowells and a plurality of electrodes. The first dielectric layer is formed on the substrate, and has a first side and a second side. The image sensor array is formed between the substrate and the second side of the first dielectric layer, and includes a plurality of image-sensing cells. The nanowells are formed in the first dielectric layer, and each of the nanowells has an opening on the first side of the first dielectric layer. Each of the electrodes extends from the second side to the first side of the first dielectric layer and is located between two adjacent nanowells.
Abstract:
An image-sensing device is provided. The image-sensing device includes a substrate, a light-sensing element, a first dielectric layer, a light-guiding structure, and a patterned conductive layer. The light-sensing element is disposed in the substrate. The first dielectric layer is disposed on the first side of the substrate. The light-guiding structure is disposed in the first dielectric layer. The patterned conductive layer is disposed between the light-sensing element and the light-guiding structure. In addition, the patterned conductive layer includes a subwavelength structure. An image-sensing system including the above image-sensing device is also provided.
Abstract:
An X-ray sensing device is provided. The X-ray sensing device includes a substrate, a first material layer, a circuit element, a photoelectric sensing element and a columnar structure. The first material layer is disposed over the substrate. The circuit element is disposed at a bottom portion of the first material layer. The photoelectric sensing is element disposed over the circuit element. The columnar structure is correspondingly disposed over the photoelectric sensing element and is in contact with the photoelectric sensing element. The columnar structure includes a scintillator material. The X-ray sensing device further includes a pad disposed on a top surface or a bottom surface of the first material layer and is coupled to the circuit element.
Abstract:
An image capture device with a reduced number of line buffers. Based on an nth line of image data provided from an image sensor array and buffered data in the line buffers, a logic circuit determines defective candidates in an nth line of image data. When the (n+p)th line of image data is provided from the image sensor array, the logic circuit reexamines the defective candidates in the nth line of image data, for defective-pixel compensation, based on the (n+p)th line of image data and the buffered data in the plurality of line buffers. The buffered data in the line buffers contains the (n−p)th to (n−1)th lines of image data while the nth line of image data is provided from the image sensor array, and contains the nth to (n+p−1)th lines of image data while the (n+p)th line of image data is provided from the image sensor array.
Abstract:
An image sensor is provided. The image sensor includes a pixel array, an analog-to-digital converter, and a processor. The analog-to-digital converter converts a black level reference signal and a pix signal from the pixel array into a first digital signal and a second digital signal, respectively. The processor obtains a black level reference value according to the first digital signal, and obtains a compensation coefficient according to the black level reference value, a maximum digital level of the analog-to-digital converter and a full signal range value. The processor obtains pix data according to the compensation coefficient, the black level reference value and the second digital signal.
Abstract:
The present invention provides an image sensor device including a substrate, a channel formed in the substrate, a photoelectric transfer region formed in the substrate located at one side of the channel, a voltage transfer region formed in the substrate located at the other side of the channel, a first gate dielectric layer formed on the substrate, a second gate dielectric layer formed on the substrate, wherein the first gate dielectric layer and the second gate dielectric layer have a joint above the channel, and the thickness of the first gate dielectric layer is thicker than that of the second gate dielectric layer, and a gate formed on the first gate dielectric layer and the second gate a is dielectric layer. The present invention also provides a method for fabricating the image sensor device.
Abstract:
An active pixel sensor comprises a sensor die and a circuit die. The sensor die comprises a plurality of pixels, wherein each pixel includes a light sensitive element and a transfer gate, a floating diffusion region, wherein the plurality of pixels include at least one reset gate. The circuit die comprises a plurality of processing and amplification circuits associated with the reset gates of the sensor die. The sensor die is interconnected with the circuit die utilizing a plurality of inter-die interconnects each coupled to a source node of a reset gate on the sensor die and a node of a processing and amplification circuit on the circuit die. The plurality of processing and amplification circuits each comprises a source follower transistor, wherein the source follower transistor uses a PMOS.
Abstract:
An image sensor is provided. The image sensor includes a substrate, a photodiode, and a storage node. The photodiode is disposed in the substrate and close to a first end of the substrate. The storage node is disposed in the substrate, adjacent to the photodiode, and close to the first end of the substrate. The image sensor further includes a first isolation structure, a first light shielding structure, an interlayer dielectric layer, and a lens structure. The first isolation structure is disposed in the substrate and over the storage node. The first light shielding structure is disposed in the first isolation structure. The interlayer dielectric layer is disposed over a second end of the substrate. The second end is opposite the first end. The lens structure is disposed over the interlayer dielectric layer.
Abstract:
A method for black-level calibration for an image-sensing device is provided. The image-sensing device includes a pixel array that has a first non-light-sensing region, a second non-light-sensing region, and an image-pixel region. The method includes the following steps: receiving a first analog signal, a second analog signal, and a third analog signal respectively from the first non-light-sensing region, the second non-light-sensing region, and the image-pixel region every predetermined scanning period; utilizing an analog-to-digital converter (ADC) of the image-sensing device to convert the first analog signal, the second analog signal, and the third analog signal to a first digital signal, a second digital signal, and a third digital signal, respectively; and performing a black-level-calibration (BLC) process on the first digital signal, the second digital signal, and the third digital signal to generate a black-level-calibrated digital signal, wherein the BLC process is implemented using a Kalman filter.