Invention Grant
- Patent Title: Compute assembly for high speed ultra dense compute blades
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Application No.: US16156732Application Date: 2018-10-10
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Publication No.: US10782749B2Publication Date: 2020-09-22
- Inventor: Wendell Lengefeld , Abhishek Mehta , William Mark Megarity , Mark E. Steinke , Benjamin Colin Heshmat
- Applicant: Cray Inc.
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14 ; G06F1/20 ; G06F1/18

Abstract:
A circuit assembly is provided which makes efficient us of space provided on a main board having a CPU and a supporting board which is designed to have a network interface chip (NIC). The circuit assembly further has a cooling plate situated between the two boards, which is optimized to provide efficient cooling operations. The circuit assembly is part of a blade, which includes a housing to contain and support all necessary components. The space within the blade housing is efficiently used, so that processing, communication and cooling operations are all optimized.
Public/Granted literature
- US20200117250A1 COMPUTE ASSEMBLY FOR HIGH SPEED ULTRA DENSE COMPUTE BLADES Public/Granted day:2020-04-16
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