公开(公告)号：US20200117250A1

公开(公告)日：2020-04-16

申请号：US16156732

申请日：2018-10-10

Applicant: Cray Inc.

Inventor： Wendell Lengefeld ,  Abhishek Mehta ,  William Mark Megarity ,  Mark E. Steinke ,  Benjamin Colin Heshmat

IPC: G06F1/20 ,  G06F1/18 ,  H05K7/20 ,  H05K7/14

Abstract: A circuit assembly is provided which makes efficient us of space provided on a main board having a CPU and a supporting board which is designed to have a network interface chip (NIC). The circuit assembly further has a cooling plate situated between the two boards, which is optimized to provide efficient cooling operations. The circuit assembly is part of a blade, which includes a housing to contain and support all necessary components. The space within the blade housing is efficiently used, so that processing, communication and cooling operations are all optimized.

公开(公告)号：US10782749B2

公开(公告)日：2020-09-22

申请号：US16156732

申请日：2018-10-10

Applicant: Cray Inc.

Inventor： Wendell Lengefeld ,  Abhishek Mehta ,  William Mark Megarity ,  Mark E. Steinke ,  Benjamin Colin Heshmat

IPC: H05K7/20 ,  H05K7/14 ,  G06F1/20 ,  G06F1/18

Abstract: A circuit assembly is provided which makes efficient us of space provided on a main board having a CPU and a supporting board which is designed to have a network interface chip (NIC). The circuit assembly further has a cooling plate situated between the two boards, which is optimized to provide efficient cooling operations. The circuit assembly is part of a blade, which includes a housing to contain and support all necessary components. The space within the blade housing is efficiently used, so that processing, communication and cooling operations are all optimized.