Invention Grant
- Patent Title: Thermally conductive structure for dissipating heat in a portable electronic device
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Application No.: US16127043Application Date: 2018-09-10
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Publication No.: US10787014B2Publication Date: 2020-09-29
- Inventor: Lee E. Hooton , Marwan Rammah , James A. Bertin , Stoyan P. Hristov , William A. Counts
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Dickinson Wright RLLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; H05K5/02 ; F28F21/08 ; B41M5/24 ; G06F1/16 ; H04M1/02 ; H01P3/08 ; H05K1/02 ; H05K1/18 ; H05K5/03 ; H05K5/06 ; H05K9/00 ; H01R12/79 ; H05K1/14 ; H02J50/10 ; H02J7/02

Abstract:
This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.
Public/Granted literature
- US20190082555A1 THERMALLY CONDUCTIVE STRUCTURE FOR DISSIPATING HEAT IN A PORTABLE ELECTRONIC DEVICE Public/Granted day:2019-03-14
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