Abstract:
An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
Abstract:
Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.
Abstract:
An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.
Abstract:
Anodic oxide coatings and methods for forming anodic oxide coatings on metal alloy substrates are disclosed. Methods involve post-anodizing processes that improve the appearance of the anodic oxide coating or increase the strength of the underlying metal alloy substrates. In some embodiments, a diffusion promoting process is used to promote diffusion of one or more types of alloying elements enriched at an interface between the anodic oxide coating and the metal alloy substrate away from the interface. The diffusion promoting process can increase an adhesion strength of the anodic oxide film to the metal alloy substrate and reduce an amount of discoloration due to the enriched alloying elements. In some embodiments, a post-anodizing age hardening process is used to increase the strength of the metal alloy substrate and to improve cosmetics of the anodic oxide coatings.
Abstract:
Techniques for making glass components for electronic devices are disclosed. The techniques disclosed herein can be used to modify a glass workpiece to form a three-dimensional glass component, such as a glass cover member. The techniques may involve reshaping the glass workpiece, fusing glass layers of the workpiece, or combinations of these. Glass components and electronic devices including these components are also disclosed.
Abstract:
An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
Abstract:
Anodic oxide coatings and methods for forming anodic oxide coatings on metal alloy substrates are disclosed. Methods involve post-anodizing processes that improve the appearance of the anodic oxide coating or increase the strength of the underlying metal alloy substrates. In some embodiments, a diffusion promoting process is used to promote diffusion of one or more types of alloying elements enriched at an interface between the anodic oxide coating and the metal alloy substrate away from the interface. The diffusion promoting process can increase an adhesion strength of the anodic oxide film to the metal alloy substrate and reduce an amount of discoloration due to the enriched alloying elements. In some embodiments, a post-anodizing age hardening process is used to increase the strength of the metal alloy substrate and to improve cosmetics of the anodic oxide coatings.
Abstract:
An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
Abstract:
Processes for enhancing the corrosion resistance of anodized substrates are disclosed. In some embodiments, the process involves a second anodizing operation that targets an area of the substrate that is left inadequately protected by a first anodizing operation, and also targets defects that may have been arisen from intermediate processing operations such as laser-marking operations. The second anodizing operation can be conducted in a non-pore-forming electrolyte, and grows a thick protective barrier film over inadequately protected areas of the substrate, such as laser-marking treated areas.
Abstract:
A process is disclosed for minimizing the difference in thermal expansivity between a porous anodic oxide coating and its corresponding substrate metal, so as to allow heat treatments or high temperature exposure of the anodic oxide without thermally induced crazing. A second phase of higher thermal expansivity than that of the oxide material is incorporated into the pores of the oxide in sufficient quantity to raise the coating's thermal expansion coefficient. The difference in thermal expansion between the anodic oxide coating and underlying metal substrate is reduced to a level such that thermal exposure is insufficient for any cracking to result. The second phase may be an electrodeposited metal, or an electrophoretically deposited polymer. The second phase may be uniformly deposited to a certain depth, or may be deposited at varying amounts among the pores.