Invention Grant
- Patent Title: Microelectromechanical component
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Application No.: US15975294Application Date: 2018-05-09
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Publication No.: US10794928B2Publication Date: 2020-10-06
- Inventor: Benny Pekka Herzogenrath , Denis Gugel , Rolf Scheben , Rudy Eid
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Norton Rose Fulbright US LLP
- Agent Gerard Messina
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@a15b515
- Main IPC: G01P15/08
- IPC: G01P15/08 ; B81B3/00

Abstract:
A microelectromechanical component including, vertically at a distance from one another, a substrate device, a first, a second, and a third functional layer, a vertical stop being formed between the second and third functional layer, the vertical stop having a stop area on a surface of the second functional layer facing the third functional layer, wherein the second functional layer is connected to the first functional layer in a connecting area allocated to the stop area.
Public/Granted literature
- US20180334381A1 MICROELECTROMECHANICAL COMPONENT Public/Granted day:2018-11-22
Information query
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