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1.发明授权公开(公告)号：US11988511B2
公开(公告)日：2024-05-21
申请号：US17908081
申请日：2021-04-14
Applicant: Robert Bosch GmbH
Inventor： Matthias Kuehnel , Nils Felix Kuhlmann , Robert Maul , Rolf Scheben , Steffen Markisch , Thorsten Balslink , Wolfram Geiger
IPC: G01C19/5712 , G01C19/5684 , G01C25/00
CPC classification number: G01C19/5712 , G01C19/5684 , G01C25/00
Abstract: A micromechanical component for a rotation rate sensor. The micromechanical component includes two rotor masses, mirror symmetrical with respect to a first plane of symmetry aligned perpendicularly to a substrate surface and passing through the center of the two rotor masses, which may be set in rotational vibrating motion about rotational axes aligned perpendicularly to the substrate surface, and four seismic masses, mirror symmetrical with respect to the first plane of symmetry, deflectable in parallel to the first plane of symmetry using the two rotor masses set in their respective rotational vibrating motion. The first rotor mass and a first pair of the four seismic masses connected thereto are mirror symmetrical to the second rotor mass and to a second pair of the four seismic masses connected thereto with respect to a second plane of symmetry aligned perpendicularly to the substrate surface and to the first plane of symmetry.
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公开(公告)号：US11874291B2
公开(公告)日：2024-01-16
申请号：US17661039
申请日：2022-04-27
Applicant: Robert Bosch GmbH
Inventor： Amin Jemili , Jochen Reinmuth , Dusan Radovic , Rolf Scheben , Steffen Becker
CPC classification number: G01P1/006 , G01P15/08 , G01P2015/0862
Abstract: A method for temperature compensation of a MEMS sensor. The method includes: in a balancing step, a temperature gradient is produced by a thermal element and a first and a second temperature are determined at a first and a second temperature measurement point, wherein a deflection of a movable structure produced by the temperature gradient is measured and a compensation value is ascertained dependent on the first and second temperature and the deflection; in a measurement step, a physical stimulus is measured by way of a deflection of the movable structure and a third and fourth temperature is determined at the first and second temperature measurement points; in a compensation step, a measured value of the physical stimulus is ascertained dependent on the measured deflection, the third and fourth temperature and the compensation value. A method is also provided including: a regulation step, and a measurement step.
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公开(公告)号：US11719539B2
公开(公告)日：2023-08-08
申请号：US17235363
申请日：2021-04-20
Applicant: Robert Bosch GmbH
Inventor： Matthias Kuehnel , Nils Felix Kuhlmann , Robert Maul , Rolf Scheben , Steffen Markisch , Thorsten Balslink , Wolfram Geiger
IPC: G01P3/44 , G01C19/5712 , G01C25/00 , B81B3/00
CPC classification number: G01C19/5712 , B81B3/0021 , G01C25/00 , G01P3/44 , B81B2201/0242
Abstract: A micromechanical component for a yaw rate sensor. The component includes a substrate having a substrate surface, a first rotor mass developed in one piece, which is able to be set into a first torsional vibration about a first axis of rotation aligned perpendicular to the substrate surface, and at least one first component of the micromechanical component. The first rotor mass is connected to the at least one first component via at least one first spring element. The at least one first spring element extends through a lateral concavity on the first rotor mass in each case and is connected to a recessed edge region of the first rotor mass. A yaw rate sensor and a production method for a micromechanical component for a yaw rate sensor, are also described.
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公开(公告)号：US20220091154A1
公开(公告)日：2022-03-24
申请号：US17447876
申请日：2021-09-16
Applicant: Robert Bosch GmbH
Inventor： Cristian Nagel , Johannes Classen , Lars Tebje , Rolf Scheben , Rudy Eid
IPC: G01P15/08 , G01P15/125 , B81B3/00
Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.
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公开(公告)号：US20210214213A1
公开(公告)日：2021-07-15
申请号：US17059729
申请日：2019-06-06
Applicant: Robert Bosch GmbH
Inventor： Jan Waldmann , Rolf Scheben , Rudy Eid
IPC: B81B3/00 , G01P1/00 , G01P1/02 , G01P15/125 , G01P3/44
Abstract: A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.
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Patent Agency Ranking
公开(公告)号：US09998828B2
公开(公告)日：2018-06-12
申请号：US14884959
申请日：2015-10-16
Applicant: Robert Bosch GmbH
Inventor： Rolf Scheben
CPC classification number: H04R7/10 , H04R19/005 , H04R19/04
Abstract: A concept is provided which permits the implementation of MEMS microphone elements having a very good SNR, high microphone sensitivity and a large frequency bandwidth. The microphone structure of the MEMS element is implemented in a layer structure and includes at least one sound pressure-sensitive diaphragm (210), an acoustically permeable counter element (220) and a capacitor system for detecting the diaphragm deflections, the diaphragm (210) and the counter element (220) being situated on top of each other and a distance apart from one another in the layer structure and each bring equipped with at least one electrode of the capacitor system. According to the invention, the layer structure of the diaphragm (210) includes at least one thin closed layer (1) and at least one thick structured layer (2), a grid structure (100) covering the entire diaphragm area being provided in the thick layer (2), which determines the stiffness of the diaphragm (210).
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公开(公告)号：US09621996B2
公开(公告)日：2017-04-11
申请号：US14793012
申请日：2015-07-07
Applicant: Robert Bosch GmbH
Inventor： Christoph Schelling , Michael Stumber , Benedikt Stein , Theresa Lutz , Rolf Scheben
CPC classification number: H04R9/048 , H04R9/025 , H04R9/08 , H04R31/006 , H04R2201/003 , H04R2209/024 , H04R2307/023
Abstract: A micromechanical sound transducer system and a corresponding manufacturing method, in which the micromechanical sound transducer system includes a substrate having a front side and a back side, the substrate having a through opening extending between the back side and the front side, and a coil configuration on the front side having a coil axis, which runs essentially parallel to the front side, the coil configuration covering the through opening at least partially. Also provided is a magnet device, which is situated so as to allow for an axial magnetic flux to be generated through the coil configuration. The coil configuration has a winding device which has at least first winding sections made from at least one layer of a low-dimensional conductive material, the coil configuration being configured to inductively detect and/or generate sound.
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公开(公告)号：US20170022046A1
公开(公告)日：2017-01-26
申请号：US15212334
申请日：2016-07-18
Applicant: Robert Bosch GmbH
Inventor： Thomas BUCK , Fabian Purkl , Michael Stumber , Rolf Scheben , Benedikt Stein , Christoph Schelling
CPC classification number: B81B3/0072 , B81B2201/0257 , B81B2203/0127 , B81B2207/015 , B81B2207/07 , H04R17/02 , H04R2201/003
Abstract: A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.
Abstract translation: 在MEMS部件的层结构中形成包括至少一个声压敏膜片元件的MEMS麦克风部件，其跨越层结构中的开口。 隔膜元件通过开口的中心区域中的至少一个柱元件附接到部件的层结构。 借助于至少一个压敏电路元件来检测隔膜元件的偏转，压敏电路元件实现在隔膜元件的层结构中，并且位于隔膜元件附接到柱元件的区域中。
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公开(公告)号：US11860184B2
公开(公告)日：2024-01-02
申请号：US17447876
申请日：2021-09-16
Applicant: Robert Bosch GmbH
Inventor： Cristian Nagel , Johannes Classen , Lars Tebje , Rolf Scheben , Rudy Eid
IPC: G01P15/08 , G01P15/125 , B81B3/00
CPC classification number: G01P15/0802 , B81B3/001 , B81B3/0051 , G01P15/125 , B81B2201/0235 , B81B2203/0163 , B81B2203/04 , G01P2015/0831 , G01P2015/0862 , G01P2015/0871
Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.
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公开(公告)号：US11485630B2
公开(公告)日：2022-11-01
申请号：US17059729
申请日：2019-06-06
Applicant: Robert Bosch GmbH
Inventor： Jan Waldmann , Rolf Scheben , Rudy Eid
Abstract: A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.
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