Invention Grant
- Patent Title: Circuit board having a passive device inside a via
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Application No.: US15089482Application Date: 2016-04-02
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Publication No.: US10798821B2Publication Date: 2020-10-06
- Inventor: Carlos Gomez
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H05K1/02 ; H05K3/34 ; H05K3/42
Abstract:
A circuit board is provided that includes a plurality of insulating layers provided in a stack to have a first surface and a second surface. A via may extend from the first surface of the stack to the second surface of the stack. A passive device may be provided in the via.
Public/Granted literature
- US20170290162A1 CIRCUIT BOARD HAVING A PASSIVE DEVICE INSIDE A VIA Public/Granted day:2017-10-05
Information query
