Invention Grant
- Patent Title: Interconnectable circuit boards adapted for lateral in-plane bending
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Application No.: US16269204Application Date: 2019-02-06
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Publication No.: US10811799B2Publication Date: 2020-10-20
- Inventor: Henry V. Holec
- Applicant: Metrospec Technology, L.L.C.
- Applicant Address: US MN Mendota Heights
- Assignee: Metrospec Technology, L.L.C.
- Current Assignee: Metrospec Technology, L.L.C.
- Current Assignee Address: US MN Mendota Heights
- Agency: Pauly, DeVries Smith & Deffner LLC
- Main IPC: H01R12/73
- IPC: H01R12/73 ; H05K1/02 ; H01R12/72 ; H01R13/52

Abstract:
Embodiments include an interconnectable circuit board array. The interconnectable circuit board array includes a plurality of interconnectable circuit boards coupled together with a plurality of board to board connectors. The board to board connectors include a first lateral side conductor and a second lateral side conductor to provide electrical communication between the connect circuit boards. The board to board connectors are configured such that when two adjacent circuit boards are bent in a lateral plane with respect to one another to form an angle, one of the lateral side conductors is contracted, one of the lateral side conductors is expanded, or one of the lateral side conductors is contracted and the other lateral side conductor is expanded. Other embodiments are also included herein.
Public/Granted literature
- US20190252810A1 INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR LATERAL IN-PLANE BENDING Public/Granted day:2019-08-15
Information query
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