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    INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR THREE-DIMENSIONAL CONSTRUCTIONS AS LIGHTING SOURCES
    1.
    发明申请
    INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR THREE-DIMENSIONAL CONSTRUCTIONS AS LIGHTING SOURCES 有权

    公开(公告)号：US20250008653A1

    公开(公告)日：2025-01-02

    申请号：US18670033

    申请日：2024-05-21

    Applicant: Metrospec Technology, L.L.C.

    Inventor： Henry V. Holec ,  Brian Hillstrom ,  Wm. Todd Crandell

    IPC: H05K1/11 ,  F21V19/00 ,  F21Y105/16 ,  F21Y115/10 ,  H01R12/72 ,  H05K1/02 ,  H05K1/14

    Abstract: Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.

    Flexible circuit board interconnection and methods
    2.
    发明授权
    Flexible circuit board interconnection and methods 有权

    公开(公告)号：US11304308B2

    公开(公告)日：2022-04-12

    申请号：US16698127

    申请日：2019-11-27

    Applicant: Metrospec Technology, L.L.C.

    Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

    IPC: B23K1/00 ,  B23K37/04 ,  H05K3/36 ,  H01R4/02 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H01R12/61 ,  H05K1/18 ,  F21Y115/10 ,  F21Y107/30

    Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

    INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR THREE-DIMENSIONAL CONSTRUCTIONS AS LIGHTING SOURCES
    4.
    发明申请
    INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR THREE-DIMENSIONAL CONSTRUCTIONS AS LIGHTING SOURCES 有权

    公开(公告)号：US20220159837A1

    公开(公告)日：2022-05-19

    申请号：US17508370

    申请日：2021-10-22

    Applicant: Metrospec Technology, L.L.C.

    Inventor： Henry V. Holec ,  Brian Hillstrom ,  Wm. Todd Crandell

    IPC: H05K1/11 ,  H05K1/14 ,  F21V19/00

    Abstract: Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.

    Interconnectable circuit boards adapted for lateral in-plane bending
    5.
    发明授权
    Interconnectable circuit boards adapted for lateral in-plane bending 有权

    公开(公告)号：US10811799B2

    公开(公告)日：2020-10-20

    申请号：US16269204

    申请日：2019-02-06

    Applicant: Metrospec Technology, L.L.C.

    Inventor： Henry V. Holec

    IPC: H01R12/73 ,  H05K1/02 ,  H01R12/72 ,  H01R13/52

    Abstract: Embodiments include an interconnectable circuit board array. The interconnectable circuit board array includes a plurality of interconnectable circuit boards coupled together with a plurality of board to board connectors. The board to board connectors include a first lateral side conductor and a second lateral side conductor to provide electrical communication between the connect circuit boards. The board to board connectors are configured such that when two adjacent circuit boards are bent in a lateral plane with respect to one another to form an angle, one of the lateral side conductors is contracted, one of the lateral side conductors is expanded, or one of the lateral side conductors is contracted and the other lateral side conductor is expanded. Other embodiments are also included herein.

    FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS
    6.
    发明申请
    FLEXIBLE CIRCUIT BOARD INTERCONNECTION AND METHODS 审中-公开

    公开(公告)号：US20200275556A1

    公开(公告)日：2020-08-27

    申请号：US16698127

    申请日：2019-11-27

    Applicant: Metrospec Technology, L.L.C.

    Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

    IPC: H05K3/36 ,  B23K37/04 ,  H01R4/02 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H01R12/61 ,  B23K1/00 ,  H05K1/18

    Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

    Compact high output LED light source with heat sink
    8.
    发明授权
    Compact high output LED light source with heat sink 有权

    公开(公告)号：US12018829B2

    公开(公告)日：2024-06-25

    申请号：US18160726

    申请日：2023-01-27

    Applicant: Metrospec Technology, L.L.C.

    Inventor： Henry V. Holec ,  Brian Hillstrom

    IPC: F28F7/00 ,  F21V29/74 ,  F21Y115/10

    CPC classification number: F21V29/74 ,  F21Y2115/10

    Abstract: Embodiments herein relate to high output LED light sources with heat sinks. In an embodiment, a high-output LED light source is included having at least one LED; a circuit board, wherein the at least one LED is mounted on a first side of the circuit board; and a coil shaped heat sink, wherein the coil shaped heat sink is thermally bonded to a second side of the circuit board. In an embodiment, a high-output LED light source is included having at least one LED, a circuit board, wherein the at least one LED is mounted on a first side of the circuit board and a continuous flat wire heat sink. The continuous flat wire heat sink can be soldered to a second side of the circuit board and the continuous flat wire heat sink can be oriented perpendicular to the circuit board. Other embodiments are also included herein.

    LED LIGHTING SYSTEMS AND METHODS
    9.
    发明申请
    LED LIGHTING SYSTEMS AND METHODS 审中-公开

    公开(公告)号：US20200053875A1

    公开(公告)日：2020-02-13

    申请号：US16450366

    申请日：2019-06-24

    Applicant: Metrospec Technology, L.L.C.

    Inventor： Henry V. Holec ,  Wm. Todd Crandell

    IPC: H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H05K3/36 ,  H01R13/717 ,  H01R12/52 ,  H01R4/02 ,  H01R12/00

    Abstract: Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

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