Invention Grant
- Patent Title: Semiconductor integrated circuit
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Application No.: US16043889Application Date: 2018-07-24
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Publication No.: US10825812B2Publication Date: 2020-11-03
- Inventor: Hiroshi Kanno , Masaharu Yamaji , Hitoshi Sumida
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2a400515
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L23/00 ; H01L29/06 ; H01L29/10 ; H02M1/08 ; H01L21/8238 ; H01L21/761

Abstract:
A semiconductor integrated circuit includes: a first well region of a first conductivity type; a second well region of a second conductivity type provided in an upper portion of the first well region; a first current suppression layer of a second conductivity type being provided to be separated from the first well region in a lower portion of a base-body of the second conductivity type directly under the first well region and having an impurity concentration higher than that of the base-body; and a second current suppression layer of the first conductivity type provided under the first current suppression layer so as to be exposed from a bottom surface of the base-body.
Public/Granted literature
- US20180331102A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2018-11-15
Information query
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