Invention Grant
- Patent Title: Fan expansion card and motherboard module
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Application No.: US16519012Application Date: 2019-07-23
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Publication No.: US10827645B2Publication Date: 2020-11-03
- Inventor: Hung-Cheng Chen , Tse-Hsien Liao , Chun-Chien Lee , Chih-Hua Ke
- Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
- Current Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@49f7296
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/18 ; G06F1/20

Abstract:
A fan expansion card includes a first circuit board and at least one first fan. The first circuit board has at least one through-hole. The first circuit board includes a first connection port having a PCI-E interface. Each of the first fans is disposed at a position on the first circuit board corresponding to the through-hole. The first fan is electrically connected to the first circuit board, wherein an airflow generated by each of the first fans passes through the corresponding through-hole. A motherboard module having the above fan expansion card is further provided.
Public/Granted literature
- US20200053910A1 FAN EXPANSION CARD AND MOTHERBOARD MODULE Public/Granted day:2020-02-13
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