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公开(公告)号：US20200296819A1
公开(公告)日：2020-09-17
申请号：US16809583
申请日：2020-03-05
Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
Inventor： Hung-Cheng Chen , Tse-Hsien Liao
IPC: H05K1/02
Abstract: A circuit board heat dissipation assembly includes a circuit board, a heat sink, a metal back plate, a heat pipe, and a pressing member. The circuit board has a front side and a rear side, and the front side has at least one heat generating area. The heat sink is disposed in the heat generating area. The metal back plate is disposed at a spacing from the rear side of the circuit board. The heat pipe has a first end, a bend segment, and a second end. The first end is connected to the heat sink. The second end is in contact with the metal back plate. The bend segment connects the first end and the second end at a side edge of the circuit board. The pressing member is fixed on the metal back plate and presses the second end onto the metal back plate.
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公开(公告)号：US20200053910A1
公开(公告)日：2020-02-13
申请号：US16519012
申请日：2019-07-23
Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
Inventor： Hung-Cheng Chen , Tse-Hsien Liao , Chun-Chien Lee , Chih-Hua Ke
Abstract: A fan expansion card includes a first circuit board and at least one first fan. The first circuit board has at least one through-hole. The first circuit board includes a first connection port having a PCI-E interface. Each of the first fans is disposed at a position on the first circuit board corresponding to the through-hole. The first fan is electrically connected to the first circuit board, wherein an airflow generated by each of the first fans passes through the corresponding through-hole. A motherboard module having the above fan expansion card is further provided.
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公开(公告)号：US20190335570A1
公开(公告)日：2019-10-31
申请号：US16120310
申请日：2018-09-03
Applicant: Giga-Byte Technology Co., Ltd.
Inventor： Hung-Cheng Chen , Tse-Hsien Liao , Chen-Te Hsu
Abstract: An illumination dummy module is adapted for covering and protecting a card slot and includes a circuit board, a power pin, a clock pin, a data pin, at least one light source, a power converter, and a drive circuit. The circuit board includes an insertion part for inserting into the card slot. The power pin, the clock pin and the data pin are disposed to the insertion part, and the light source is disposed on the circuit board. The power converter receives input power from the card slot via the power pin, and converts the input power into output power. The drive circuit is disposed on the circuit board, and receives the output power from the power converter. The drive circuit also respectively receives a clock signal and a control command via the clock pin and the data pin, to enable or disable the light source.
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公开(公告)号：US11157048B2
公开(公告)日：2021-10-26
申请号：US16558343
申请日：2019-09-03
Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
Inventor： Hung-Cheng Chen , Tse-Hsien Liao , Chun-Chien Lee , Chen-Te Hsu
Abstract: A memory module with a screen includes a memory substrate, a power conversion module, a screen control module, and a screen. The memory substrate includes a plurality of memory components and a connection interface. The power conversion module is disposed on the memory substrate and electrically connected to the connection interface. The screen control module is disposed on the memory substrate and electrically connected to the connection interface and the power conversion module. The screen is disposed on the memory substrate, and the screen is electrically connected to the power conversion module and the screen control module to receive a voltage output from the power conversion module and a display signal output from the screen control module. A motherboard module including a memory module with a screen is also provided.
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公开(公告)号：US20210274640A1
公开(公告)日：2021-09-02
申请号：US17113113
申请日：2020-12-07
Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
Inventor： Hung-Cheng Chen , Tse-Hsien Liao
Abstract: A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.
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Patent Agency Ranking
公开(公告)号：US20200383191A1
公开(公告)日：2020-12-03
申请号：US16857175
申请日：2020-04-23
Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
Inventor： Hung-Cheng Chen , Tse-Hsien Liao
Abstract: A lighting memory device and a memory module are provided. A lighting control circuit receives at least one lighting mode selection signal through lighting mode control pins and controls luminous characteristics of a plurality of light sources according to a lighting control mode corresponding to the lighting mode selection signal.
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公开(公告)号：US20240414887A1
公开(公告)日：2024-12-12
申请号：US18587973
申请日：2024-02-27
Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
Inventor： Chih-Hua Ke , Hung-Cheng Chen , Tse-Hsien Liao , Ching-Yi Chang
Abstract: A temperature adjustment module is provided. The temperature adjustment module includes a temperature changing module and a temperature control module. The temperature changing module includes a temperature changing area. The temperature changing module is in contact with a peripheral circuit element on a motherboard through the temperature changing area and a heat conduction material. The temperature control module is electrically connected to the temperature changing module and configured to control a temperature of the temperature changing module to reach a target temperature. The temperature changing module further includes a printed circuit board in the temperature changing area, and the temperature of the temperature changing module is changed by at least one of a winding wire or an electronic component on the printed circuit board.
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公开(公告)号：US11612050B2
公开(公告)日：2023-03-21
申请号：US17113113
申请日：2020-12-07
Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
Inventor： Hung-Cheng Chen , Tse-Hsien Liao
Abstract: A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.
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公开(公告)号：US11216649B2
公开(公告)日：2022-01-04
申请号：US16853103
申请日：2020-04-20
Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
Inventor： Hung-Cheng Chen , Tse-Hsine Liao , Chin Hui Chen , Chih-Hua Ke
Abstract: A display device capable of automatically adjusting displayed image comprises a display device, a camera assembly, an image recognition device and a signal processor. The display device including a shell and a display panel partially exposed from the shell, wherein the display panel faces a first direction. The camera assembly obtains a first image with a first visual angle and obtain a second image with a second visual angle. The image recognition device generates a first instruction when the first image meets a first condition and generates a second instruction when the second image meets a second condition. The signal processor adjusts the display signal to conceal the displayed image according to the first instruction and to adjust the display signal to generate a reminder message on the displayed image according to the second instruction.
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公开(公告)号：US10827645B2
公开(公告)日：2020-11-03
申请号：US16519012
申请日：2019-07-23
Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
Inventor： Hung-Cheng Chen , Tse-Hsien Liao , Chun-Chien Lee , Chih-Hua Ke
Abstract: A fan expansion card includes a first circuit board and at least one first fan. The first circuit board has at least one through-hole. The first circuit board includes a first connection port having a PCI-E interface. Each of the first fans is disposed at a position on the first circuit board corresponding to the through-hole. The first fan is electrically connected to the first circuit board, wherein an airflow generated by each of the first fans passes through the corresponding through-hole. A motherboard module having the above fan expansion card is further provided.
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